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Material analysis and inspection play an extremely important role in the manufacturing and production process and are crucial to ensuring product quality, improving production efficiency and meeting customer needs.

MSP team and partners can assist customers in the following material analysis or monitoring. Whether in the semiconductor industry or other industries, quality control or process capability improvement can be achieved through analytical services.

In addition, the company continues to plan and build various measurement resources, and can also provide various measurement resource inquiry and delivery services.

Service features of Wei Technology on MSP

professional
Personnel have professional skills and background knowledge, and have many years of practical experience in the industry
quick
100% provide test reports within the promised time
support
Provide comprehensive support and services; for any incurable diseases, Shangwei Technology will try its best to find solutions for you
quilty
Passed the international certification of ISO/IEC 17025:2017
Certificate number: IECQ-L ULTW 24.0003
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Material selection evaluation

Material analysis helps evaluate the quality performance of a material, which is important in determining whether the material is suitable for a specific application.
contorl

Quality Control

In the manufacturing process, process capabilities and materials directly affect the quality of the final product. By analyzing materials and products, we can ensure that they meet requirements and prevent product defects caused by process or material problems.
analysis

Exception Analysis

When a product fails or an exception occurs, inspection analysis can be used to track the root cause of the problem. This is important for performing anomaly analysis, improving product design, and preventing future anomalies.
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Improvement and Innovation

Inspection analysis can provide valuable data about the manufacturing process, which can be used to improve and optimize the process and improve product quality. At the same time, it also helps to promote innovation and introduce new technologies and methods to improve efficiency and quality.
Inductively coupled plasma mass spectrometry (ICP-MS)-Agilent 7900

Inductively coupled plasma mass spectrometry (ICP-MS)

Agilent 7900

A flexible single quadrupole ICP mass spectrometer that provides the industry's best matrix tolerance, most efficient helium collision mode, lowest detection limits and widest dynamic range.

ICP-MS stands for Inductively Coupled Plasma Mass Spectrometry (Inductively Coupled Plasma Mass Spectrometry), which is a highly sensitive and high-resolution analytical technology mainly used to determine the presence and concentration of elements.

The principle of ICP-MS is based on the sample being injected into an inductively coupled plasma to form a high-temperature plasma. The energy in this plasma is enough to ionize the atoms in the sample. The ionized atoms are separated and detected by a mass spectrometer, and based on their mass/charge ratio, the presence and concentration of the element can be determined.

Reference: www.agilent.com

Features

High sensitivity

ICP-MS has extremely high sensitivity and can detect very low concentrations. Element, the widest dynamic range in quadrupole ICP-MS, providing up to 11 orders of magnitude dynamic range, from ppt levels to hundredth-level concentrations.

High Resolution

Due to the use of a mass spectrometer, ICP-MS has high resolution, making it Able to distinguish between different elements of very close mass.

Multi-element analysis

ICP-MS can measure multiple elements simultaneously, which makes it possible to It is widely used in analytical applications in various fields, such as environmental monitoring, biomedical research, food testing, etc.

Quick Feedback

ICP-MS 7900 has ultra-fast data acquisition function and can complete 10,000 data per second independent measurements

ICP-MS service items
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Secondary Ion Mass Spectrometer

Secondary Ion Mass Spectrometer (SIMS)

Cameca IMS-7F, IMS-4F ,TOF.SIMS5-100

Can provide quantitative analysis and in-depth analysis of trace elements and impurities; mainly semiconductor materials, including metal and dielectric materials. Detection can provide information on elemental composition and chemical structure. Extensible for analyzing insulating and biomedical materials.

Secondary Ion Mass Spectrometry (SIMS) is a highly sensitive surface analysis technology that is often used in fields such as semiconductors, materials science, life sciences, and geology. SIMS can provide very detailed information on the elemental composition and chemical structure of the surface.

Features

High spatial resolution

SIMS has a very high spatial resolution, which can reach sub-micron or The smaller scale allows for high-precision analysis of tiny areas.

High sensitivity

SIMS is capable of detecting elements at very low concentrations, typically in parts per million to a concentration range of 1 part per billion.

Surface composition analysis

SIMS is mainly used for surface analysis, so it can analyze the composition and structure of the material surface. Details are provided.

Details
Atomic Force Microscope (AFM)-Digital Instrument D3100

Atomic force microscope (AFM)

Bruker Dimension Edge

It can analyze the surface morphology and physical properties of materials, sample hardness and other mechanical quality testing of materials.

AFM stands for Atomic Force Microscope and is a high-resolution microscope that has many uses. It is a powerful tool that plays an important role in nanoscale research and applications in various fields, including materials science, biology, nanotechnology, etc.

Features

Patented Technology

Dimension Edge uses Bruker's patented PeakForce Tapping ® technology to provide the best-in-class products in its class. High level of atomic force microscope performance and functionality.

Widely used

Corresponding experimental plans can be formulated according to different research directions, and it has advanced Nanoscale measurement capabilities.

Accurate measurement

Features low drift and low noise, improving data acquisition speed and reliability sex. Its integrated visual feedback and pre-configured settings make it like an expert operating on-site, with highly consistent measurement results.

Details
Laser Scanning Conjugate Focus Microscope (LSCM)-KEYENCE, VK-X250K

Laser scanning conjugate focus microscope (LSCM)

KEYENCE, VK-X250K

This device combines the functions of an optical microscope, a scanning electron microscope and a surface roughness meter

Laser Scanning Conjugate Microscope (LSCM) is an advanced optical imaging technology that provides high resolution, high contrast and real-time observation capabilities, making it an ideal choice for materials science in various fields. or an indispensable tool in fields such as biological sciences.

Basic principles and characteristics of LSCM

Scan system

LSCM consists of a scanning system that uses lenses or prisms to direct a laser beam as it moves across the surface of the sample. Through rapid scanning of fixed-point light sources, LSCM can construct high-resolution images in three-dimensional space.

Confocal technology

By using confocal technology, the system ensures that only light from the focal plane passes through the detector, thereby eliminating scattered light from other parts of the sample. This improves the contrast and resolution of the image.

3D imaging

Due to the characteristics of the scanning system, LSCM can acquire images at focal planes at different depths. This allows researchers to construct highly detailed three-dimensional sample structures.

Details
High-resolution X-ray diffractometer XRD

High-resolution X-ray diffractometer (XRD)

X’Pert3 MRD Series

High-end equipment for material analysis, used in advanced materials science, scientific and industrial thin film technology, semiconductor process development and other fields, can be used to study and analyze crystal structure, crystal phase, lattice parameters, crystal size, etc.

High-end equipment for material analysis is used in advanced materials science, scientific and industrial thin film technology, semiconductor process development and other fields. It can be used to study and analyze the measurement of crystal structure, crystal phase, lattice parameters, crystal size, etc.

Features

The X’Pert3 MRD Series offers advanced features and performance, making it an important analytical tool in materials science.
Here are some of its main features:

  1. High resolution:
    Excellent resolution enables accurate analysis of tiny crystal structure changes and features
  2. Versatility:
    Supports a variety of analysis modes, including powder diffraction (XRD), reflection diffraction (XRR), etc., making it suitable for a variety of different types of samples and applications .
  3. Automation:
    Equipped with an automated control system and a high-throughput sample carrier, it can achieve fast and efficient sample analysis.
  4. Smart Measurement:
    Equipped with professional data analysis software, it can realize comprehensive analysis and processing of diffraction data and provide high-quality results.
  5. Flexible configuration and scalability:
    Can be customized and expanded according to user needs to meet the requirements of different applications
  6. Integrated X-ray Solution System:
    Available for many industrial applications including semiconductor and single crystal wafers, polycrystalline solids and thin films, ultrathin films, nanomaterials and Amorphous layer etc.

Application

Semiconductors and monocrystalline wafers

Whether used for growth research or device design, the process of using high-resolution XRD to measure structural layer quality, thickness, stress, and alloy composition has become an important part of electronic and optoelectronic multilayer The core of research and development of semiconductor equipment.

With a wide selection of X-ray mirrors, monochromators and detectors, the X'Pert3 MRD and MRD XL offer high-resolution configurations to suit different material systems - from lattice-matched semiconductors, to delayed buffer layers , to new foreign layers on non-standard substrates.

Reciprocal Space Exploration
▲ Reciprocal space exploration
Swing Curve Analysis
▲Swing Curve analysis

Polycrystalline Solids and Thin Films

Whether used for growth studies or device design, the process of using high-resolution XRD to measure structural layer quality, thickness, stress, and alloy composition has become an important part of electronic and optoelectronic multilayer The core of research and development of semiconductor equipment.

Polycrystalline layers and coatings are an important component of many thin film and multilayer devices. The evolution of polycrystalline layer morphology during deposition is a major research area in the development of functional materials.

X'Pert3 MRD and X'Pert3 MRD XL can be fully equipped with a series of incident light path components such as slit systems, parallel X-ray mirrors, polycapillary lenses, cross slits and single capillaries for reflection Rate, stress, texture and phase identification tests to make selections.

Structural Analysis
▲Structural Analysis
Reflectance
▲Reflectance

Ultra-thin films, nanomaterials and amorphous layers

Functional devices may contain disordered, amorphous or nanocomposite films.
The flexibility of the X'Pert3 MRD and MRD XL systems allows the combination of multiple analytical methods.

A range of high resolution optics, slit and parallel plate collimators are available to achieve optimal performance for grazing incidence, in-plane diffraction and reflectivity testing.

Grazing incident phase identification
▲Grazing incident phase identification
In-plane diffraction
▲ internal diffraction

Measurement under non-temperature conditions

Studying how materials change under various conditions is an important part of materials research and process development.

The X’Pert3 MRD and MRD XL are specifically designed to easily integrate with Anton Paar’s DHS1100 non-temperature sample stage, enabling automated measurements over a range of temperature ranges and inert gas environments.

Peak height as a function of temperature and time
▲Peak height changes with temperature and time
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